TY - GEN
T1 - Elastrographic assessment of micromotion-induced strain in tissue adjacent to intracortical implants in rat
AU - Stiller, Allison M.
AU - Basavarajappa, Lokesh
AU - Brown, Katherine
AU - Voit, Walter
AU - Pancrazio, Joseph J.
AU - Hoyt, Kenneth
PY - 2019/10
Y1 - 2019/10
N2 - Intracortical electrodes are important components of neural interfaces, but are limited in clinical applications due to high rates of device failure. This is in part due to a chronic neuroinflammatory response, which may be a result of mechanical mismatch between stiff implanted devices and the surrounding tissue. In this study, we used ultrasound (US)-based elastography to measure strain maps in vivo around intracortical devices. Experiments were performed by implanting shape memory polymer (soft) and silicon (stiff) devices in rat cortex. The results indicate higher strains in regions-of-interest containing stiff devices, indicating the possible effects of mechanical mismatch on micromotion-induced tissue strain.
AB - Intracortical electrodes are important components of neural interfaces, but are limited in clinical applications due to high rates of device failure. This is in part due to a chronic neuroinflammatory response, which may be a result of mechanical mismatch between stiff implanted devices and the surrounding tissue. In this study, we used ultrasound (US)-based elastography to measure strain maps in vivo around intracortical devices. Experiments were performed by implanting shape memory polymer (soft) and silicon (stiff) devices in rat cortex. The results indicate higher strains in regions-of-interest containing stiff devices, indicating the possible effects of mechanical mismatch on micromotion-induced tissue strain.
KW - elastography
KW - neuroinflammation
KW - Share memory polymer (SMP)
KW - strain
KW - ultrasound
UR - http://www.scopus.com/inward/record.url?scp=85077629372&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85077629372&partnerID=8YFLogxK
U2 - 10.1109/ULTSYM.2019.8925593
DO - 10.1109/ULTSYM.2019.8925593
M3 - Conference contribution
AN - SCOPUS:85077629372
T3 - IEEE International Ultrasonics Symposium, IUS
SP - 435
EP - 438
BT - 2019 IEEE International Ultrasonics Symposium, IUS 2019
PB - IEEE Computer Society
T2 - 2019 IEEE International Ultrasonics Symposium, IUS 2019
Y2 - 6 October 2019 through 9 October 2019
ER -